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Stanford Advanced Materials
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  • SN3988 SnBi30Cu0.5 Tin-based Alloy soldering paste

    • SN3988 SnBi30Cu0.5 Tin-based Alloy soldering paste

    Catalogue Number SN3988
    Composition Tin, Bismuth, Copper
    Appearance Dark grey paste

    SnBi30Cu0.5 Tin-based Alloy Solder Paste possesses a suitable melting point and can be utilised with original Lead soldering machines while minimising thermal impact on electronic components. Stanford Advanced Materials (SAM) has extensive experience in the manufacture and supply of high-quality SnBi30Cu0.5 Tin solder paste.

    Related products: SnCu0.7 Tin-based Alloy Solder Powder, SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg1.0Cu0.5 Tin-based Alloy Solder Powder, SnAg3.0Cu0.5 Tin-based Alloy Solder Powder

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